PRODUCT DESCRIPTION:
Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.
Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.
GENERAL PROPERTIES
| Appearance | Dark Grey |
| Cure Type | Heat cure or Room Temperature |
| Benefits | Strong
Durable
High impact bonds at room temperature |
| Mix Ratio by weight | 100:7 / Resin: Hardener |
| Outgassing, NASA | Passes |
| Typical Applications | Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards |
UNCURED PROPERTIES
| Specific Gravity, mixed | 2.44 |
| Reactive solids contents, % | 100 |
| Pot Life | 30 minutes |
| Shelf life | 1 Year |
THERMAL PROPERTIES
| CTE, linear | 10.0 in/in-F @ Temperature 68.0 F |
| Thermal Conductivity | 6.94 BTU-in/hr-ft-F
1.00 W/m-K |
| Glass transition temperature (Tg), C | 110 C, 230 F |
| Operating Temperature | -70 to 110 C / -94 to 230 F |
CURED PROPERTIES
| Hardness, Shore D | 90 |
| Dielectric strength, volts/mil | 410 |
CURE SCHEDULE
| 2 4 Hours | @ 65C |
| 24 Hours | @ 25C |
ELECTRICAL PROPERTIES
| Volume Resistivity | 5.50e+15 ohm-cm
4.00e+13 ohm-cm @ Temperature 212 F |
| Dielectric Constant | 6.0 @ Frequency 1000 Hz |
| Dielectric Strength | 410 kV/in |
| Dissipation Factor | 0.010 @ Frequency 1000 Hz |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best result.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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