Electro-Bond 04 Silver Filled Epoxy Adhesive, Electrically Conductive Adhesive, Circuit Repair, 1 Part Heat Cure

Electro-Bond 04 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly. Electro-Bond 04 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list.Electro-Bond 04 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures Up to 175°C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication. This high performance conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures Up to 325°F."