thermally conductive electrically insulating heat cure epoxy high temperature resistance adhesive Thermo-bond 54

Thermo-Bond 54 is recommended for high temperature aerospace and electronic applications where the combination of good thermal conductivity AND low electrical conductivity is required for thermal links (staking electrical components -- diodes, integrated circuits, transistors, precision resistors, or capacitors -- to chassis or circuit boards). This two-part thixotropic epoxy system is meant easy handling and mixing at room temperature -- although a final high temperature bake at 100°C is REQUIRED for full cure. Thermo-Bond 54 bonds strongly to ceramics (alumina, porcelain and beryllia), to glass and to many metals and plastics, and its thermal expansion coefficient is a good match for many other electronic materials (i.e. copper and aluminum) over a wide temperature range. The fully cured adhesive develops strong, durable electrically insulating/thermal conducting bonds with good impact properties, and which are also resistant to galvanic action, weathering, water, salts, mild alkalis and acids, many petroleum products, and many other organic and inorganic compounds. An additional post-cure of 4 hours at 145°C is recommended when application temperatures higher than 145°C are anticipated.

thermally-conductive--electrically-insulating-heat-cure-epoxy-high-temperature-resistance-adhesive