PRODUCT DESCRIPTION:
Wood-Bond 1 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required.
Wood-Bond 1 is versatile two-part epoxy system contains no solvents, mixes easily at room temperature, and is suitable for high performance structural bonding applications where the combination of very fast room temperature curing coupled with low shrinkage and excellent mechanical and electrical properties is needed.
Wood-Bond 1 develops strong, tough bonds to metals, plastics, concrete, sheetrock, marbel, stone, rock, tile, plaster, cement, glass and glass fabrics, hardboards and forestry products, Woods, rubber, masonry materials, and other construction materials.
Wood-Bond 1 is an excellent electrical insulator, and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solutions, and many other organic and inorganic compounds.
Wood-Bond 1 develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25C is required for fully matured bonds.
Note: Wood-Bond 1 develops a high exotherm. Use immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready before mixing.
GENERAL PROPERTIES
| Appearance | Slight haze/ slight straw |
| Cure Type | Room temperature or Heat cure |
| Benefits | Resistant to many organic/inorganics
Strong bond strength
Great electrical insulator
Durable |
| Mix Ratio by weight | 100:100 / Resin:Hardener |
| Substrates | metals, plastics, concrete, sheetrock, tile, marble, stone, rock, plaster,cement,glass fabrics, wood, leather and rigid plastics |
| Operating Temperature | -60 to 110 C |
| Typical Application(s) | Anything requiring the unique properties this adhesive offers |
| Pot Life | 5 minutes |
UNCURED PROPERTIES:
| Viscosity @ 25 C, mPas (cP) | Thixotropic |
| Solids Content | 100% |
| Specific Gravity, mixed | 1.2 g/cc |
CURE SCHEDULE:
| 30 minutes | @ 65C |
| 2 hours | @ 25C |
MISC PROPERTIES:
| Volume Resistivity | 5.00e+11 ohm-cm |
| Dielectric Constant | 4.8 |
| Dielectric Strength | 410kV/in |
| CTE, linear | 33.3 in/in-F@ RT |
| Hardness, Shore D | 70 |
| Glass Transition Temp, Tg | 25.0 C, 77.0 F |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply Wood-Bond 1 Hour Cure Strongest Industrial Grade Epoxy Adhesive Quickly Hardens completely mixed adhesive to theprepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided maycrystallize when subjected to low temperature storage. Agentle warming cycle of 52C for 30 minutes prior to mixingcomponents may be necessary. Crystallized epoxycomponents do not react as well as liquid components andshould be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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