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AA-BOND F131 High Temp, Fast Cure, Low Visc, 2 Part, Fiberoptics Epoxy Adhesive

$3.99
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Atom Adhesives
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Product Description

HIGH TG ROOM TEMPERATURE CURE FIBER OPTIC ADHESIVE


PRODUCT DESCRIPTION:

AA-BOND F131 is two parts fiber-optic adhesive used for terminating ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components.

AA-BOND F131 produces a typical Tg of 95 C thus meeting specification requirements of connectors manufacturers.

AA-BOND F131 is two part, low viscosity system can be cured at room temperature or as fast as 15 minutes at 90 C.

GENERAL PROPERTIES

Appearance Clear
Cure Type Room Temperature or Heat cure
Benefits Low viscosity
Mix Ratio by weight 100:30 / Resin:Hardener
Operating Temperature -60 to 120 C
Typical Applications ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components.
Volume Resistivity 1.00e+11 ohm-cm

UNCURED PROPERTIES:

Viscosity @ 25 C 1,800 200
Thixotropic Index 1.0
Specific Gravity, mixed, g/cc 1.21

CURE SCHEDULE:

15 minutes @ 90C; 1 drop applications
1 hour @ 65C
18 hours @ 25C

CURED PROPERTIES:

Glass transition temperature (Tg), C 95
Hardness, Shore D 77
Lap shear strength, psi 3600 (Alum to Alum)

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.

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