PRODUCT DESCRIPTION:
FDA-Bond 2T Food & Drug Administration Medical Grade Epoxy Adhesive, For Medical Equipement is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.
FDA-Bond 2T Food & Drug Administration Medical Grade Epoxy Adhesive, For Medical Equipement is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, lubricants and fuels, to mild acids and alkalis, and many other organic and inorganic compounds.
PRODUCT PROPERTIES:
| Appearance | Amber |
| Cure Type | Heat cure or Room Temperature |
| Benefits | Medium viscosity
Electrically Insulating
Low permeability to gases and vapors
Low temperature cure |
| Mix Ratio by weight | 100:93 / Resin: Hardener |
| Typical Applications | Medical, Food preparation processing and packaging |
UNCURED PROPERTIES:
| Viscosity @ 25 C, cps | 25000 1000 |
| Specific Gravity, mixed | 1.119 |
| Pot Life | 3 hours |
CURE SCHEDULE:
| 1 to 4 Hours | @ 65C |
| 24 Hours | @ 25C |
THERMAL PROPERTIES:
| CTE, linear | 29.4 in/in-F @ temperature 68 F |
| Glass Transition Temp, Tg | 70.0 C, 158 F |
| Operating Temperature | -70 to 145 C |
CURED PROPERTIES:
| Coefficient of Thermal Expansion, cm/cm/C | 5.3010-05 |
| Hardness, Shore D | 79 |
| Elongation at Yield | 9.0 % |
| Adhesive Bond Strength | 1800 psi |
ELECTRICAL PROPERTIES:
| Volume Resistivity | 1.20e+14 ohm-cm |
| Dielectric Constant | 3.4 @ frequency 1000 Hz |
| Dielectric Strength | 420 kV/in |
| Dissipation Factor | 0.020 |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply FDA-Bond 2T Food & Drug Administration Medical Grade Epoxy Adhesive, For Medical Equipement completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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