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Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing

$3.99
Brand Name:
Epoxy International
Quantity:

Product Description

ELECTRICALLY INSULATING THERMALLY CONDUCTIVE EPOXY ADHESIVE


PRODUCT DESCRIPTION:

Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics.

Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing was specifically developed for fiber optic, laser, photonic and electronic applications requiring excellent electrical insulation in combination with effective thermal dissipation from heat-producing components.

Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing is two-part epoxy compound develops strong, durable, stable, high impact thermally conductive bonds at room temperature, and adheres readily to itself, and to metals, many plastics, silica, steatite, alumina, sapphire and other ceramics, glass, and to many other materials.

Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing provides excellent resistance to salt solutions, mild acids and alkalis and many other chemicals including petroleum solvents, lubricating oils and alcohol.

GENERAL PROPERTIES

Appearance Ligh grey/off white
Cure Type Room Temperature or Heat cure
Benefits Smooth paste
Fiber optic
Laser
Photonic and electronic applications
Good electrical insulation
Mix Ratio by weight 100:10 / Resin:Hardener
Substrates Metals, Many plastics, Glass, and other materials
Operating Temperature -60 to 120 C
Typical Applications ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components.

UNCURED PROPERTIES:

Viscosity @ 25 C Paste
Thixotropic Index 1.0
Specific Gravity, mixed, g/cc 2.29

CURE SCHEDULE:

2-4 hours @ 65C
24 hours @ 25C
Volume Resistivity 2.10e+15 ohm-cm
Dielectric Constant 5.9 @ Frequency 1000 Hz
Dielectric Strength 16.1 kV/mm 410 kV/in
Dissipation Factor 0.010 @ Frequency 1000 Hz

CURED PROPERTIES:

Thermal Conductivity 6.09 BTU-in/hr-ft-F
Hardness, Shore D 88

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.

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