Thermally Conductive Epoxy Paste Low NASA Outgassing Adhesive Thixotropic Electrically Insulating

Thermo-Bond 53 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. Thermo-Bond 53 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 53 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. Thermo-Bond 53 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.