Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epoxy Adhesive
Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epoxy Adhesive represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive.
Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epoxy Adhesive cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar and dissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards.
Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epoxy Adhesive, because of its excellent continuity, has been used extensively in such diversified applications as, microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer or stamping techniques.
|Cure Type||Heat cure or Room temperature|
|Benefits||High strength |
EMI & RFI shielding
|Minimum Bond Line Thickness||1mm|
|Glass Transition Temp, Tg||50 C|
|Substrates||Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.|
|Typical Applications||microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder.|
|Viscosity @ 25 C cps||Paste|
|Silver coated ceramic , %||50 to 75|
|Pot Life @ RT||1 Hour|
|Mix ratio, by weight||100:5 / Resin:Hardener|
|Shelf life||1 Year|
|15 minutes||@ 100C|
|30 minutes||@ 60C|
|24 hours||@ Room temperature|
|Volume Resistivity||< 0.0015|
|Hardness, Shore D||81|
|Compressive Strength, psi||13,600|
|Shrinkage Linear, in / in||0.004|
|Specific Gravity, 25C / 25C||2.60|
|Tensile Strength, psi||8,900|
|Compressive Strength, psi||13,700|
|Thermal Conductivity, btu / hr / ft2 / F / in||90|
|Thermal Expansion Coefficient, (cm / cm / C 10-5)||1.9|
|Heat Distortion, C||165|
|Operating Temperature Range, C||-50 to +165|
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epoxy Adhesive completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.