PRODUCT DESCRIPTION:
Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state.
Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry.
PRODUCT PROPERTIES:
| Appearance | Silver |
| Cure Type | Heat cure |
| Benefits | High strength
Perfect bond
EMI & RFI shielding
Wave guides |
| Substrates | Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. |
| Catalyst | Anhydride |
| Hardness, Shore D | 83 |
| Typical Applications | microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry. |
UNCURED PROPERTIES:
| Viscosity @ 25 C cps | 6,800 |
| Density gm/cc | 2.35 |
| Silver , % | 70-72 |
| Shelf life | 6 Months |
| Operating Temperature | -45C to 170C |
| Pot Life @ 25 C | 6 months @ 25C
9 months refrigerated |
CURE SCHEDULE:
| 60 min | @ 120C, 248F |
| 30 mins | @ 150C, 302F |
| 10 mins | @ 175C, 347F |
PHYSICAL CHARACTERISTICS:
| Sheet Resistivity | 10-12 m/sq |
| Bulk Resistivity | 3x10-5/cm |
| Adhesion Tensile Strength | 1000 N/cm2 (1500 lb/in2) |
| Lap shear Strength | 1400 N/cm2 (2000 lb/in2) |
| Thermal Conductivity | 0.04J/(cm.s. C):[0.01cal/(cm.s. C)] |
| Specific heat | 0.30J/(g. C) :[0.07 cal/g. C] |
| Coefficient of Thermal Expansion | 3x10-5 (m/m)/ C |
| Modulus of elasticity: | 4x10+10(4*10 power of +10) Pa (6x105lb/in2) |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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