AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.
GENERAL PROPERTIES
Components
A & B
Appearance
Brown
Cure Type
Room temperature or Heat cure
Benefits
Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices. It can be used in medical circuits using traditional hybrid packaging technologies. High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight
100:13.5 / Resin:Hardener
Substrates
Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics
Operating Temperature
Continuous: - 55C to 275C Intermittent: - 55C to 375C
Typical Applications
Adhesive for joining die and SMDs onto the hybrid circuits Repairing defective Au thick-film conductor traces and contact pads Resisting oxidation and electro-migration in high-reliability micro-electronics Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300C
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