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AA-BOND G298 Gold Epoxy Adhesive, 2 Part, Electrically and Thermally Conductive

$249.99

Brand Name:

Atom Adhesives

* Size:

2.5gm pouch(s)
5gm pouch(s)
10gm pouch(s)
20gm pouch(s)

Quantity:

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Product Description

GOLD EPOXY ADHESIVE

PRODUCT DESCRIPTION:

AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

GENERAL PROPERTIES

Components	A & B
Appearance	Brown
Cure Type	Room temperature or Heat cure
Benefits	Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices. It can be used in medical circuits using traditional hybrid packaging technologies. High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight	100:13.5 / Resin:Hardener
Substrates	Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics
Operating Temperature	Continuous: - 55C to 275C Intermittent: - 55C to 375C
Typical Applications	Adhesive for joining die and SMDs onto the hybrid circuits Repairing defective Au thick-film conductor traces and contact pads Resisting oxidation and electro-migration in high-reliability micro-electronics Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300C