PRODUCT DESCRIPTION:
Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
Strong-Bond 112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
GENERAL PROPERTIES
| Appearance | Milky translucent |
| Cure Type | Room temperature or Heat Cure |
| Benefits | Tough enamel like cure
Bonds variety of substrates
Good electrical insulation
Weather resistant |
| Mix Ratio by weight | 100:22 / Resin:Hardener |
| Substrates | Metals, glass, ceramics, wood and many plastics |
| Operating Temperature | -60 to 125 C |
| Typical Applications | Printed circuit board repair, staking components, bonding, laminating and repair applications |
UNCURED PROPERTIES:
| Viscosity @ 25 C, mPas (cP) | 60000 cPs |
| Thixotropic Index | 6.5 |
| Specific Gravity, mixed | 1.2 |
| Reactive solids contents, % | 100 |
| Pot Life | 30 minutes |
CURE SCHEDULE:
| 4 hours | @ 65C |
| 24 hours | @ 25C |
MISC PROPERTIES:
| Volume Resistivity | 6.00e+13 ohm-cm |
| Dielectric Constant | 4.6 |
| Dielectric Strength | 16.1 kV/in |
| CTE, linear | 55.0 m/m-C@ Temperature 20.0 C |
| Glass Transition Temp, Tg | 93 C |
| Hardness, Shore D | 90 |
| Lap shear | 1900 psi (Alum to Alum) |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply the mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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